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CS1009 2.5 Volt Reference
The CS1009 is a precision trimmed 2.5 V 5.0 mV shunt regulator diode. The low dynamic impedance and wide operating current range enhances its versatility. The tight reference tolerance is achieved by on-chip trimming which minimizes voltage tolerance and temperature drift. A third terminal allows the reference voltage to be adjusted 5.0% to calibrate out system errors. In many applications, the CS1009GZ can be used as a pin-to-pin replacement of the LT1009CZ and the LM136Z-2.5 with the external trim network eliminated. Features * 0.2% Initial Tolerance Max. * Guaranteed Temperature Stability * Maximum 0.6 Dynamic Impedance * Wide Operating Current Range * Directly Interchangeable with LT1009 and LM136 for Improved Performance * No Adjustments Needed for Minimum Temperature Coefficient * Meets Mil Std 883C ESD Requirements
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SO-8 D SUFFIX CASE 751
TO-92 Z SUFFIX CASE 29 1 2 3
PIN CONNECTIONS AND MARKING DIAGRAM
NC NC NC GND 1 1009 ALYW 8 NC NC VREF ADJ. PIN
5.0 V-35 V
1009 YWW
3.6 k VREF ADJ
Pin 1. ADJ. PIN 2. VREF 3. GND
1 10 k TRIM A WL, L YY, Y WW, W = Assembly Location = Wafer Lot = Year = Work Week
GND
*5.0% Trim Range
Figure 1. Application Diagram ORDERING INFORMATION
Device CS1009GD8 CS1009GDR8 CS1009GZ3 CS1009GZR3 Package SO-8 SO-8 TO-92 TO-92 Shipping 95 Units/Rail 2500 Tape & Reel 2000 Units 2000 Tape & Reel
(c) Semiconductor Components Industries, LLC, 2002
1
February, 2002 - Rev. 7
Publication Order Number: CS1009/D
CS1009
VREF
10 pF
P3
N14
N16
15 pF
P1 14 k 20 pF
P2
TRIM 20 k 20 k 10.15 k 63 k N7 N12 N13 30 k ADJ N9 N10 N11 1.14 k 6.785 k D1 N15
N2 N1 N3 N4
N8
N5
N6 1.14 k SUBSTRATE GND
Figure 2. Block Diagram
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CS1009
MAXIMUM RATINGS*
Rating Reverse Current Forward Operating Temperature Range Storage Temperature Range Lead Temperature Soldering: 1. 10 second maximum 2. 60 second maximum above 183C. *The maximum package power dissipation must be observed. Wave Solder (through hole styles only) (Note 1) Reflow: (SMD styles only) (Note 2) Value 20 10 -40 to 105 -65 to +150 260 peak 230 peak Unit mA mA C C C C
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise specified.)
Characteristic Reverse Breakdown Voltage Reverse Breakdown Voltage Reverse Breakdown Voltage Reverse Breakdown Voltage Change with Current Reverse Dynamic Impedance Temperature Stability Avgerage Temperature Coefficient Long Term Stabilty IR = 1.0 mA 0C TA 105C -40C TA C 400 A IR 10 mA IR = 1.0 mA 0C TA 70C, Note 3 0C TA 70C, Note 3 TA = 25C 0.1 C, IR = 1.0 mA { { Test Conditions Min 2.492 2.492 2.480 - - - - - - - Typ 2.500 2.500 2.500 2.6 3.0 0.2 0.4 - - 20 Max 2.508 2.508 2.508 10 12 1.0 1.4 - - - Unit V V V mV mV mV ppm/C ppm/kHr
Denotes the specifications which apply over full operating temperature range. 3. Average temperature coefficient is defined as the total voltage change divided by the specified temperature range.
TYPICAL PERFORMANCE CHARACTERISTICS
10-1 REVERSE VOLTAGE CHANGE (mV) 1.4 1.8 REVERSE VOLTAGE (V) 2.2 2.6 5
REVERSE CURRENT (A)
10-2
4
3
10-3
2
10-4 TJ = 25C 1.0
1
10-5 0.5
0 0 4 8 12 16 REVERSE VOLTAGE (V) 20
Figure 3. Reverse Current vs. Reverse Voltage
Figure 4. Change in Reverse Voltage vs. Reverse Current
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CS1009
()
1.2 FORWARD VOLTAGE (V) TJ = 25C 1.0 0.8 0.6 0.4 0.2 0 0.001
100 DYNAMIC IMPEDANCE () 0.01 0.1 1.0 10
10
1.0
0.1 10
100
FORWARD CURRENT (mA)
1.0 k 10 k FREQUENCY (Hz)
100 k
Figure 5. Forward Voltage vs. Forward Current
Figure 6. Dynamic Impedance vs. Frequency
250 VOLTAGE SWING (V) IR = ImA TJ = 25C NOISE (nV/HZ) 200 0 2.5 2.0 1.5 1.0 0.5 0 5.0 k INPUT OUTPUT
150
100 10.0 4.0 0 10 100 1.0 k FREQUENCY (Hz) 10 k 100 k
50
0
1 TIME (s)
20
Figure 7. Zener Noise Voltage vs. Frequency
Figure 8. Response Time
2.520 REFERENCE VOLTAGE (V)
2.510
2.500
2.490
-40
-30
0
25
35
70
105
Figure 9. Reference Voltage vs. Temperature
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CS1009
PACKAGE DIMENSIONS
SO-8 D SUFFIX CASE 751-07 ISSUE V
-X- A
8 5
B
1 4
S
0.25 (0.010)
M
Y
M
-Y- G C -Z- H D 0.25 (0.010)
M SEATING PLANE
K
MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0_ 8_ 0.010 0.020 0.228 0.244
N
X 45 _
0.10 (0.004)
M
J
ZY
S
X
S
DIM A B C D G H J K M N S
TO-92 Z SUFFIX CASE 29-11 ISSUE AL
A R P L
SEATING PLANE
B
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM.
K
DIM A B C D G H J K L N P R V
XX G H V
1
D J C SECTION X-X N N
INCHES MIN MAX 0.175 0.205 0.170 0.210 0.125 0.165 0.016 0.021 0.045 0.055 0.095 0.105 0.015 0.020 0.500 --0.250 --0.080 0.105 --0.100 0.115 --0.135 ---
MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.407 0.533 1.15 1.39 2.42 2.66 0.39 0.50 12.70 --6.35 --2.04 2.66 --2.54 2.93 --3.43 ---
PACKAGE THERMAL DATA Parameter RJC RJA Typical Typical SO-8 45 165 TO-92 - 170 Unit C/W C/W
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CS1009
Notes
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CS1009
Notes
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CS1009
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: ONlit@hibbertco.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada JAPAN: ON Semiconductor, Japan Customer Focus Center 4-32-1 Nishi-Gotanda, Shinagawa-ku, Tokyo, Japan 141-0031 Phone: 81-3-5740-2700 Email: r14525@onsemi.com ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative.
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CS1009/D

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